Scribing of SiC / GaN
Cost-Effective Laser Processing for SiC / GaN
——Ultrashort pulses aren't the only answer.
For hard-to-machine materials such as SiC (silicon carbide) and GaN (gallium nitride), we have broken the industry's reliance on expensive lasers. Through the power of process control, we enable high-quality machining with a general-purpose light source.
Challenge: High Cost of Ultrashort-Pulse Lasers
For scribing and dicing of next-generation power semiconductors and high-thermal-conductivity substrates, ultrashort-pulse lasers (picosecond or femtosecond) are the conventional choice to avoid heat-affected zones. However, these oscillators are extremely expensive, making it difficult to reduce per-unit production costs. "Cost is unavoidable if you want quality" was the shared understanding across the industry.
Solution: The Nanosecond Alternative
——Unlocking the potential of nanosecond lasers.
Quantec's approach is not to buy expensive tools, but to work with the physics. By precisely synchronizing pulse energy and scan speed with a comparatively affordable nanosecond laser, we achieve machining quality on par with ultrashort-pulse systems.
Benefits
- Lower initial cost: Dramatically reduces equipment price and depreciation burden.
- Lower running costs: General-purpose light sources keep maintenance parts and energy costs down.
- Quality maintained: Achieves edge quality and practical yield comparable to ultrashort-pulse systems.
Target Materials
- SiC (Silicon Carbide)
- GaN (Gallium Nitride)
- AlN (Aluminum Nitride)
- Other brittle materials
