Process-Driven Laser Engineering
for Manufacturing.
Quantec designs laser processing from the material reaction up —
delivering scalable, production-ready integration.
Industries
- Semiconductors
- Electronic Components
- Food Packaging
- Glass Processing
- Automotive
- etc.
Process-Driven Laser Engineering
From R&D to Production
Quantec designs laser processing systems from the material reaction up — not from existing equipment constraints. From process development and R&D support to full production line integration, we deliver end-to-end solutions for laser processing challenges that standard systems cannot solve.
Process-First Design
We start from your material, your quality target, and your production constraints — then engineer the laser system around them.
In-House Equipment Development
PICTURA and our processing systems are developed in-house, giving us full control over process performance.
End-to-End Support
From first sample evaluation at our Application Labs to stable mass production — we stay involved at every stage.
Your challenge — laser can overcome it.
A selection of the laser processes Quantec has established — for materials and geometries where standard systems fall short.
Enamel Wire Stripping
UV-only insulation removal — copper-safe, no secondary wavelength required.
Reduces process complexity for motor winding, sensor lead prep, and precision wire assemblies in automotive and industrial electronics.
Reduces process complexity for motor winding, sensor lead prep, and precision wire assemblies in automotive and industrial electronics.
Transparent Resin Welding
Clear-to-clear bonding without pigment or adhesive.
Low contamination and optical clarity make it the right choice for medical device housings, optical sensors, and diagnostic assemblies.
Low contamination and optical clarity make it the right choice for medical device housings, optical sensors, and diagnostic assemblies.
SiC / GaN Scribing
Nanosecond-laser scribing at ultrashort-pulse cut quality — lower cost, production-viable throughput.
Enables volume dicing for power semiconductors and compound semiconductor wafers where ultrashort-pulse ROI doesn't pencil out.
Enables volume dicing for power semiconductors and compound semiconductor wafers where ultrashort-pulse ROI doesn't pencil out.
A process-driven laser platform for large-area, high-speed, stitching-free processing.
PICTURA is Quantec's in-house laser platform engineered for large-area, high-speed, stitching-free processing. Built from process-first principles, it expands what laser processing can do — into cutting, welding, drilling, and patterning at scale.
Large-area scanning up to 2,000mm
Stitching-free quality
Configurable wavelength (IR / UV / Green / CO2)
Integration-ready for production lines
Cutting, welding, drilling, patterning
Higher throughput vs. conventional systems
We believe in LASER.
Quantec is a process-driven laser company based in Tokyo, Japan. We combine deep understanding of material interaction physics with full in-house engineering capability — from process development through system integration and production support.