Laser Marker｜PICTURA
Specification
| Wavelength | IR (1064nm) |
GR (532nm) |
UV (355nm) |
10.6μm | 9.3μm |
|---|---|---|---|---|---|
| Output | 20～500W | 10W | 5/10W | 30W | 20W |
| Max. Scan Range | 1600×1600 ×200mm |
600×600 ×150mm |
600×600 ×150mm（※） |
2000×2000 *3D: 800×800×150mm |
1200×1200 *3D: 800×800×150mm |
| Spot Diameter | 0.11mm | 0.04mm | 0.03mm | 0.6mm | 0.6mm |
| Primary Materials | ・Metal ・Ceramic |
・Metal ・Ceramic |
・Metal ・Ceramic ・Film ・Resin |
・Film ・Glass |
・Film ・Glass |
| Options | [All wavelengths] High power / CCD + image processing alignment / Auto focus / Telecentric lens specification / Processing software, etc. | ||||
（※）
UV Large-Area Model — □800×800×200mm
A new model supporting large-area processing needs at UV wavelength (355nm) is currently under development.
Ideal For
- Avoid heat-affected zones
- Process large workpieces in a single pass
- Require processing beyond marking
- Achieve large-area processing with air cooling
Context: The Gap
Functional, but not optimal.
The market is shifting toward larger workpiece sizes and process consolidation, with growing demand to use laser markers for large-area and non-marking applications. However, conventional laser markers were originally designed for “marking and traceability” — built around small areas and fixed output. As a result, equipment designed for different purposes is being pressed into use, creating a gap where compromises in throughput and quality are unavoidable.
Design Philosophy
The Process Is Always the Starting Point
Rather than starting from the equipment, we define the optimal wavelength, output, and scan area by working backwards from the required process. Process-driven design allows us, as an SIer, to deliver equipment that is genuinely optimized for the objective.
Explore Our Strengths
Working Backwards from Physics to Processing
How does light interact with matter?
——Knowing the physics lets us realize the processing you need.
- Reproducibility
- Optimal Conditions
- High-Quality Processing
Because PICTURA is a laser device made by an SIer, we can satisfy all three.
Optimized for the Processing Objective
——Beyond marking. Designed as a true processing platform that covers removal, cutting, and welding.
Working with partners, expansion into inspection, traceability, and system integration is also possible.
Consult on PICTURA Implementation
Value of PICTURA
Handles large-area and 3D processing, accommodating workpiece tolerances while reducing cycle time.
Quality / Speed
——Done in one pass, so fast and high-quality.
Mass-Production Stability
PICTURA can cover large areas even with air cooling, but can also be expanded to water cooling for higher reproducibility in mass production.
As an SIer, we can propose integration into existing processes. Rather than full custom orders from scratch, we deliver our system integration value as the "PICTURA" package.
Case Examples Unique to an SIer
We handle image processing alignment, on-the-fly processing, roll processing, and full equipment integration. Working with partners, expansion into traceability and system integration is also possible.
Implement Benefits
Process Improvement
- Reduced equipment changeovers
- Lower downtime risk
- Reduced maintenance costs
Improved Takt & Stability
- Faster cycle times through single-unit batch processing
- Leading to more consistent, stable operation
High-Quality Processing
Particularly effective for large-scale area processing.
Before
After